 2023年1/2月刊
编者寄语 Editor’s Notes
在不确定中迎接新的 发展契机
技术中心 Technologies Center
红外超快激光脉冲串实现晶圆内部3D加工
Ultrafast infrared laser bursts enable writing inside semiconductor chips
“半导体化”光子学时代来临
Now is the time to ‘semiconductorize’ photonics
硅光芯片即将迎来应用拐点？
Driving the era of silicon photonics with integrated lasers
快速了解基于CMOS相机的激光光束分析仪
Quick tutorial: laser beam profiling with camera-based systems
访谈 Interview
对光子学、创新、合作的热情带领公司大步向前
Passion for photonics, innovation and collaboration leads the company to stride forward
Interview with MKS Instruments CEO Dr. John T.C. Lee
市场观察 Market Watch
尽管有逆风，光子学市场依然呈现乐观增长预期
Despite headwinds, the photonics industry still presents optimistic growth expectations
前沿简讯 Leading Edge Snapshot
前沿简讯
Leading Edge Snapshot
工业应用专栏 Industrial Laser Column
激光加工结合仿生学实现自清洁光伏面板
Lasers, biomimetics enable self-cleaning photovoltaic panels
柔性激光表面预处理提升连接性能
Flexible laser surface pre-treatment for joining
使用两种增材制造工艺打印混合材料制成的航 天部件
Laser metal deposition for additive manufacturing a hybrid propulsion component for space
激光加工技术在航空航天领域的应用
A glimpse into laser applications in aerospace
纳秒红外光纤激光实现半导体材料的激光焊接
Laser welding for semiconductors
产品撷英 Products Highlight
产品撷英
Products Highlight
广告索引 Ad Index
广告索引
AD Index
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研究人员在半导体材料内部写入结构，展示了3D激光写入方法在推动半导体制造从2D向高密度3D集成器件发展方面的巨大潜力。